| 000 | 01083cam a22002894a 4500 | ||
|---|---|---|---|
| 001 | 14503114 | ||
| 003 | IIITD | ||
| 005 | 20220902020003.0 | ||
| 008 | 060817s2007 nyua b 001 0 eng | ||
| 010 | _a 2006932950 | ||
| 020 | _a9780387366425 | ||
| 040 |
_aDLC _cDLC _dDLC |
||
| 050 | 0 | 0 |
_aTK7874.6 _b.G65 2007 |
| 082 |
_a621.395 _bGOL-P |
||
| 100 | 1 | _aGolshan, Khosrow | |
| 245 | 1 | 0 |
_aPhysical design essentials : _ban ASIC design implementation perspective _cKhosrow Golshan. |
| 260 |
_aNew York : _bSpringer, _c©2007. |
||
| 300 |
_axvii, 211 p. : _bill. ; _c24 cm. |
||
| 504 | _aIncludes bibliographical references and index. | ||
| 650 | 0 | _aApplication-specific integrated circuits. | |
| 650 | 0 | _aMicroelectronic packaging. | |
| 856 | 4 | 1 |
_3Table of contents only _uhttp://www.loc.gov/catdir/toc/fy0711/2006932950.html |
| 856 | 4 | 2 |
_3Publisher description _uhttp://www.loc.gov/catdir/enhancements/fy0825/2006932950-d.html |
| 906 |
_a7 _bcbc _corignew _d2 _eepcn _f20 _gy-gencatlg |
||
| 942 |
_2ddc _cBK _03 |
||
| 999 |
_c13688 _d13688 |
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