000			02001nam a22002297a 4500
003			IIITD
005			20240116175012.0
008			240115b xxu||||| |||| 00| 0 eng d
020			_a9789390385515
040			_aIIITD
082			_a621.381 _bTUM-F
245			_aFundamentals of device and systems packaging : _btechnologies and applications _cedited by Rao R. Tummala
250			_a2nd ed.
260			_aChennai : _bMcGraw Hill, _c©2019
300			_a828 p. : _bill. ; _c25 cm.
501			_aIncluding Index
505			_tPart 1 Fundamentals of Packaging 2 Fundamentals of Electrical Design for Signals, Power, and Electromagnetic Interference 3 Fundamentals of Thermal Technologies 4 Fundamentals of Thermo-Mechanical Reliability 5 Fundamentals of Package Materials at Microscale and Nanoscale 6 Fundamentals of Ceramic, Organic, Glass, and Silicon Package Substrates 7 Fundamentals of Passive Components and Integration with Active Devices 8 Fundamentals of Chip-to-Package Interconnections and Assembly 9 Fundamentals of Embedded and Fan-Out Packaging 10 Fundamentals of 3D Packaging with and without TSV 11 Fundamentals of RF and Millimeter-Wave Packaging 12 Fundamentals of Optoelectronics Packaging 13 Fundamentals of MEMS and Sensor Packaging 14 Fundamentals of Package Encapsulation, Molding, and Sealing 15 Fundamentals of Printed Wiring Boards 16 Fundamentals of Board Assembly _tPart 2 Applications of Packaging Technologies 17 Applications of Packaging Technologies in Future Car Electronics 18 Applications of Packaging Technologies in Bioelectronics 19 Applications of Packaging Technologies in Communication Systems 20 Applications of Packaging Technologies in Computing Systems 21 Applications of Packaging Technologies in Flexible Electronics 22 Applications of Packaging Technologies in Smartphones Index.
650			_aMicroelectronic packaging
650			_aElectronics engineering
700			_aTummala, Rao R. _eeditor
942			_2ddc _cBK
999			_c171070 _d171070